{"entity":{"id":646,"slug":"export-control-classification-number-eccn-3b001","name":"Export Control Classification Number (ECCN) 3B001","type":"instrument","role":"Classification code for semiconductor manufacturing equipment under US export controls","description":null,"imageUrl":null,"createdAt":"2026-04-08T20:05:12.211Z","updatedAt":"2026-05-19T09:20:10.634Z"},"electedOffice":null,"significance":{"score":11.6,"components":{"totalFindings":0,"connectionDegree":7.6,"recentFindings90d":0,"activeResearchJobs":0,"goblinAttributions":4,"recentSyntheses90d":0,"moneyFlowChainsTotal":0,"closedLoopMemberships":0,"moneyFlowHopsRecent90d":0},"computedAt":"2026-10-15T01:32:54.708Z"},"facts":[{"id":11322,"text":"ECCN 3B001 controls equipment for manufacturing semiconductor devices, materials, or related equipment and specially designed components and accessories","confidence":"primary","dateOccurred":"2023-10-25","source":{"title":"Federal Register rule 88 FR 73424 establishing current ECCN 3B001 controls","url":"https://www.bis.doc.gov/index.php/licensing/commerce-control-list-classification/export-control-classification-number-eccn","publication":"Directed Inquiry — Web Search"}},{"id":11326,"text":"Country Group D:5 restrictions apply to ECCN 3B001 equipment exports, affecting licensing requirements for multiple destinations beyond China","confidence":"primary","dateOccurred":"2023-10-17","source":{"title":"October 2023 BIS rule updates expanding geographic scope of semiconductor controls","url":"https://www.bis.gov/iec","publication":"Directed Inquiry — Web Search"}}],"connections":[{"id":16476,"relationshipType":"oversight","description":"CFIUS reviews foreign investments involving entities subject to ECCN 3B001 export controls due to national security concerns.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":450,"name":"Committee on Foreign Investment in the United States","slug":"committee-on-foreign-investment-in-the-united-states","type":"government_agency"}},{"id":16475,"relationshipType":"oversight","description":"Magnachip's semiconductor manufacturing operations and equipment are potentially subject to ECCN 3B001 controls.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":449,"name":"Magnachip Semiconductor Corporation","slug":"magnachip-semiconductor-corporation","type":"company"}},{"id":16474,"relationshipType":"transaction subject","description":"Wise Road Capital's acquisition activities involving Magnachip Semiconductor were reviewed under CFIUS, with ECCN 3B001 relevant to the semiconductor equipment controls at issue.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":448,"name":"Wise Road Capital LTD","slug":"wise-road-capital-ltd","type":"company"}},{"id":16473,"relationshipType":"oversight","description":"NXP manufactures semiconductor devices using equipment that may be subject to ECCN 3B001 export restrictions.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":577,"name":"NXP Semiconductors","slug":"nxp-semiconductors","type":"company"}},{"id":16472,"relationshipType":"oversight","description":"Amkor provides semiconductor packaging and test services using equipment potentially controlled under ECCN 3B001.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":664,"name":"Amkor Technology Korea","slug":"amkor-technology-korea","type":"company"}},{"id":16471,"relationshipType":"oversight","description":"Lam Research produces semiconductor manufacturing equipment that may be classified under ECCN 3B001.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":665,"name":"Lam Research Manufacturing Korea","slug":"lam-research-manufacturing-korea","type":"company"}},{"id":16470,"relationshipType":"oversight","description":"ASML manufactures advanced lithography equipment for semiconductor production, likely falling under ECCN 3B001 controls.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":666,"name":"ASML","slug":"asml","type":"company"}},{"id":16469,"relationshipType":"oversight","description":"Poongsan Microtec is involved in semiconductor materials and equipment, potentially subject to ECCN 3B001 regulations.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":464,"name":"Poongsan Microtec","slug":"poongsan-microtec","type":"company"}},{"id":16468,"relationshipType":"oversight","description":"Hanmi Semiconductor produces equipment for semiconductor manufacturing that may be classified under ECCN 3B001.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":20,"name":"Hanmi Semiconductor","slug":"hanmi-semiconductor","type":"company"}},{"id":16467,"relationshipType":"oversight","description":"Intel manufactures semiconductor devices using equipment potentially controlled under ECCN 3B001.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":8901,"name":"Intel Corporation","slug":"intel-corporation","type":"company"}},{"id":16466,"relationshipType":"oversight","description":"TSMC is a major semiconductor foundry whose manufacturing equipment may be classified under ECCN 3B001, subjecting it to export controls.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":8900,"name":"Taiwan Semiconductor Manufacturing Company (TSMC)","slug":"taiwan-semiconductor-manufacturing-company-tsmc","type":"company"}},{"id":16465,"relationshipType":"oversight","description":"Samsung Electronics, as a semiconductor manufacturer, uses equipment controlled under ECCN 3B001 and is subject to related export restrictions.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":8899,"name":"Samsung Electronics","slug":"samsung-electronics","type":"company"}},{"id":16464,"relationshipType":"oversight","description":"Nvidia manufactures semiconductor devices and related equipment that may be classified under ECCN 3B001 for export control purposes.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":24,"name":"Nvidia","slug":"nvidia","type":"company"}},{"id":16463,"relationshipType":"oversight","description":"Applied Materials Korea is a semiconductor equipment supplier whose products may fall under ECCN 3B001 controls.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":643,"name":"Applied Materials Korea (AMK)","slug":"applied-materials-korea-amk","type":"company"}},{"id":16462,"relationshipType":"oversight","description":"YEST Co. is mentioned in context with ECCN 3B001 and semiconductor manufacturing equipment controls, likely as a company subject to these export classifications.","confidence":"inferential","firstDocumented":"2026","lastDocumented":null,"other":{"id":647,"name":"YEST Co.","slug":"yest-co","type":"company"}},{"id":1015,"relationshipType":"potential_licensing_requirement","description":"HPSP as Korean semiconductor equipment manufacturer would require BIS export licenses for ECCN 3B001 equipment to controlled destinations","confidence":"likely","firstDocumented":null,"lastDocumented":null,"other":{"id":19,"name":"HPSP","slug":"hpsp","type":"company"}},{"id":16458,"relationshipType":"oversight","description":"Export license applications for ECCN 3B001 equipment must be submitted through the SNAP-R electronic portal system.","confidence":"primary","firstDocumented":"2026","lastDocumented":null,"other":{"id":645,"name":"Simplified Network Application Process Redesign 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(HPHA)","slug":"high-pressure-hydrogen-annealing-hpha","type":"instrument"}}],"contradictions":[],"permalink":"https://www.goblinhouse.net/entity/export-control-classification-number-eccn-3b001","timelineUrl":"https://www.goblinhouse.net/entity/export-control-classification-number-eccn-3b001/timeline"}