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[ENTITY FILE] SUBJECT-0019 COMPANY ACTIVE
HP
// Subject

HPSP‌​‍​​‍‌‌​‌‍‌‍​​‌‍‌‍‍‍‌‍‍​‌‌

Korean semiconductor equipment manufacturer; 'Korea's ASML'
Tracked Korean semiconductor equipment manufacturer; 'Korea's ASML' · 21 documented connections
// Editorial summary — AI-generated from public records

High-pressure hydrogen annealing equipment manufacturer. Founded 2017, KOSDAQ-listed 2022. 'World's only manufacturer' of high-pressure hydrogen annealing equipment for advanced semiconductor processing. Sales grew to 181.4 billion won by 2024 (639% return). Market cap ~3.5 trillion won ($2.4B). Crescendo holds 39.42% stake.

Facts on record229
Connections mapped21
Sources cited43
Stated vs Revealed
No documented contradictions on file.
PATTERN company → [industry peer] → company PATTERN company → [product] → instrument PATTERN company → [supplier] → company PATTERN company → [program administrator] → institution PATTERN company → [competitor] → company
Connection Map
Key Connections
Entity #94
administered_by
HPSP (Health Professions Scholarship Program) is administered by the Department of Defense under 10 U.S.C. § 2121-2128. The DoD manages the program through military branches to recruit medical professionals, with funding flowing through military personnel accounts.
Entity #81
program_administrator
The US Army is one of the military branches that administers HPSP, recruiting medical professionals through full tuition scholarships in exchange for active duty service obligations.
Entity #83
program_administrator
The US Navy is one of the military branches that administers HPSP, recruiting medical professionals through full tuition scholarships in exchange for active duty service obligations.
Entity #82
program_administrator
The US Air Force is one of the military branches that administers HPSP, recruiting medical professionals through full tuition scholarships in exchange for active duty service obligations.
Entity #18
portfolio company investment
Crescendo Equity Partners holds a documented 39.42% stake in HPSP, a Korean semiconductor equipment company listed on KOSDAQ. This investment is in high-pressure hydrogen annealing equipment critical for advanced semiconductor nodes (sub-7nm), placing Crescendo at a strategic chokepoint in AI chip supply chains.
Entity #8899
supplier
Provides critical semiconductor annealing equipment
Entity #8901
supplier
Supplies semiconductor processing equipment
Entity #8900
supplier
Key customer for advanced chip manufacturing equipment
Facts (229)
Data Freshness
Fresh Last update: 22d ago · Avg age: 181d
Confidence Tiers: Primary Source — cross-referenced government/corporate filings Pending Review — sourced but not independently verified AI Inference — analytical hypothesis from cross-referencing
✓ Verified Findings (9)
These facts have been cross-referenced and confirmed against their source material.
Verified Pending Review Journalist should investigate whether HPSP is an acronym (e.g., Health Professions Scholarship Pro‌​‍​​‍‌‌​‌‍‌‍​​‌‍‌‍‍‍‌‍‍​‌‌gram, or a foreign company name) and search under potential full names or parent company structures
Added: 07 Apr 2026
Verified Pending Review The complete absence of results across all major U.S. public databases (SEC, USASpending, lobbying, courts, corporate registrations) suggests HPSP ma‌​‍​​‍‌‌​‌‍‌‍​​‌‍‌‍‍‍‌‍‍​‌‌y be a non-U.S. entity, a subsidiary operating under a parent company name, or an acronym/abbreviation requiring clarification of its full legal name
Added: 07 Apr 2026
Verified Pending Review Investigation of HPSP (Korean semiconductor company) in European contexts should focus on (1) European Chips Act supply chain di‌​‍​​‍‌‌​‌‍‌‍​​‌‍‌‍‍‍‌‍‍​‌‌scussions, (2) EPO patent filings, and (3) potential EU subsidiary registrations rather than hypothetical political party records
Date: 2024-06-15 Added: 06 Apr 2026
Verified Pending Review To identify potential US regulatory footprints for Korean HPSP, researchers should investigate (1) CHIPS Act equipment procurement records, (2) Crescendo Equity Partners' US fund registrations, and (3) US semiconductor company supplier disclosures—not federal healthcare spending databases
Date: 2024-06-15 Added: 06 Apr 2026
Verified Pending Review Without a specific jurisdiction or policy context, the exact parliamentary record references cannot be definitively identified as 'HPSP' may refer to different programs or policies in different legislative bodies
Date: N/A Added: 05 Apr 2026
Verified Pending Review Specific contribution amounts, dates, and recipients require direct FEC database query at FEC.gov for current and precise figures
Date: 2024-06-15 Added: 05 Apr 2026
Verified Pending Review HPSP may also refer to the Health Professions Scholarship Program (military program), which is not an SEC-filing entity
Date: N/A Added: 05 Apr 2026
Verified Pending Review Individual HPSP participants making personal political contributions would be listed by their military branch or medical institution as employer in FEC individual contribution records, not under 'HPSP'
Date: Ongoing Added: 05 Apr 2026
Verified Pending Review If HPSP refers to a subsidiary or private entity, it would not be required to file independent SEC reports unless it meets specific reporting thresholds or is a guarantor on registered securities
Date: 2024-06-15 Added: 05 Apr 2026
Raw Filing Records (199) — unsourced metadata
Pending Review HPSP's market capitalization reached approximately 3.5 trillion won ($2.4 billion) by 2025
Date: 2025-01-01 Added: 15 Apr 2026
Pending Review Crescendo acquired HPSP in 2017 for approximately 10 billion won (~$7 million) through the Presto No. 6 Fund
Date: 2017-01-01 Added: 15 Apr 2026
Pending Review HPSP is often dubbed 'Korea's ASML' and dominates the market for semiconductor annealing equipment
Date: 2025-01-01 Added: 15 Apr 2026
Pending Review Korean semiconductor equipment companies operating through US private equity structures face dual regulatory oversight from both Korean Fair Trade Commission merger rules and potential CFIUS voluntary notification incentives
Date: 2024-06-15 Added: 09 Apr 2026
Pending Review HPSP's exclusive supplier status in hydrogen annealing equipment creates concentrated regulatory footprints that enable more targeted supply chain monitoring than diversified semiconductor equipment markets
Date: 2024-06-15 Added: 09 Apr 2026
Pending Review Crescendo's 2025 exit from HPSP represents the first major private equity divestiture of a monopolistic semiconductor equipment supplier during the post-CHIPS Act regulatory environment
Date: 2025-06-15 Added: 09 Apr 2026
Pending Review The characterization of private equity structures creating systematic visibility gaps in semiconductor supply chain monitoring appears to misunderstand the parallel operation of export licensing and procurement oversight mechanisms
Date: 2024-06-15 Added: 09 Apr 2026
Pending Review BIS export control requirements under ECCN 3B001.f.1.c create mandatory documentation for Korean semiconductor equipment sales that operates independently of private equity disclosure cascades
Date: 2024-06-15 Added: 09 Apr 2026
Pending Review HPSP's monopolistic position in high-pressure hydrogen annealing equipment means any US government procurement would generate uniquely identifiable documentation in federal spending databases, contradicting claims about supply chain visibility gaps
Date: 2024-06-15 Added: 09 Apr 2026
Pending Review HPSP's monopolistic position in high-pressure hydrogen annealing creates potential single points of failure in EU semiconductor supply chains independent of private equity ownership changes
Date: 2024 Added: 09 Apr 2026
Pending Review Crescendo's 7-year hold period on HPSP (2017-2024) aligns with standard private equity investment timelines rather than EU policy coordination
Date: 2024 Added: 09 Apr 2026
Pending Review Korea's DART electronic disclosure system provides the primary regulatory pathway for HPSP ownership change documentation, operating independently of competition authority oversight
Date: 2024 Added: 09 Apr 2026
Pending Review Korean Fair Trade Commission merger notification requirements apply to transactions that may substantially restrict competition in Korean markets, not to foreign private equity exit transactions
Date: 2024 Added: 09 Apr 2026
Pending Review HPA has demonstrated significant performance improvements in FinFET, GAA, and Memory devices including advanced DRAM and 3D NAND
Date: 2024-01-15 Added: 08 Apr 2026
Pending Review HPSP technology enables annealing at lower temperatures with high pressure, essential for front-end semiconductor manufacturing in advanced nodes
Date: 2024-01-15 Added: 08 Apr 2026
Pending Review High-Pressure Hydrogen Annealing has become an essential step especially in advanced node semiconductor manufacturing
Date: 2024-01-15 Added: 08 Apr 2026
Pending Review HPSP signed a Joint Development Project agreement with imec on January 10, 2024, to strengthen R&D on High-Pressure Annealing and High Pressure Oxidation
Date: 2024-01-10 Added: 08 Apr 2026
Pending Review HPSP has been jointly researching with imec since 2015 to explore benefits of high-pressure annealing on various semiconductor devices
Date: 2015-01-01 Added: 08 Apr 2026
Pending Review HPSP spun off from Poongsan Co., Ltd. in April 2017 after starting as Equipment Business Team of PSMC in October 2005
Date: 2017-04-01 Added: 08 Apr 2026
Pending Review Most of HPSP's systems are being exported to the US, Japan, and Taiwan, while its reliance on China is low
Date: 2025-08-21 Added: 08 Apr 2026
Pending Review HPSP achieved an operating margin rate of 53.7% in the first half of 2024, making it the highest among top 50 fab equipment makers in South Korea
Date: 2025-08-21 Added: 08 Apr 2026
Pending Review HPSP is the world's first and only company to develop and manufacture high-pressure hydrogen annealing equipment for semiconductor manufacturing
Date: 2024-01-17 Added: 08 Apr 2026
Pending Review The characterization of BIS export controls as 'additional' documentation reflects a regulatory misunderstanding—export licensing represents the standard oversight mechanism for foreign semiconductor equipment, not a supplementary system to federal procurement databases
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review BIS export control requirements under ECCN 3B001.f.1.c represent the primary regulatory mechanism for Korean semiconductor equipment sales to US manufacturers, creating mandatory documentation that would be publicly accessible through targeted FOIA requests using specific license numbers
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review HPSP reported sales of 179.1 billion won and net profit of 66 billion won in 2022, with growth rates of 74% and 87% respectively
Date: 2022-12-31 Added: 08 Apr 2026
Pending Review HPSP trades under the ticker symbol 403870 on KOSDAQ
Added: 08 Apr 2026
Pending Review HPSP was listed on the KOSDAQ in 2022
Date: 2022-01-01 Added: 08 Apr 2026
Pending Review Global logic chip firms and South Korean memory makers all procure HPA systems from HPSP for high-end chip production
Added: 08 Apr 2026
Pending Review HPSP is currently the exclusive supplier of HPA (High-pressure hydrogen annealing) used in the front-end of chip production
Added: 08 Apr 2026
Pending Review HPSP was listed on KOSDAQ in July 2022
Date: 2022-07-01 Added: 08 Apr 2026
Pending Review Crescendo's 2025 divestiture of HPSP to major US private equity firms represents a potential trigger event for enhanced US regulatory oversight of Korean semiconductor equipment supply chains
Date: 2025 Added: 08 Apr 2026
Pending Review Korean HPSP's potential US government procurement would generate documentation through at least four parallel systems: CHIPS Act spending records, BIS export licenses under ECCN 3B001, potential CFIUS review of Crescendo's exit, and SEC disclosures by acquiring US private equity firms
Date: 2024 Added: 08 Apr 2026
Pending Review Major global PE firms including Carlyle, Blackstone, and MBK Partners have bid for HPSP stake
Date: 2024-01-01 Added: 08 Apr 2026
Pending Review HPSP's revenue grew from 24 billion won in 2018 to 1.79 trillion won in 2023, achieving a 53% operating margin
Date: 2023-12-31 Added: 08 Apr 2026
Pending Review HPSP manufactures high-pressure hydrogen annealing (HPA) equipment and is the world's sole supplier of this technology
Added: 08 Apr 2026
Pending Review HPSP was listed on the KOSDAQ market in July 2022
Date: 2022-07-01 Added: 08 Apr 2026
Pending Review HPSP was originally the equipment business division of Poongsan Group's subsidiary Poongsan Microtec before the Crescendo acquisition
Date: 2017-01-01 Added: 08 Apr 2026
Pending Review Korean HPSP's high-pressure hydrogen annealing equipment falls under mandatory BIS export licensing requirements for sales to US semiconductor manufacturers, creating Department of Commerce documentation that operates parallel to but independent of federal procurement oversight
Added: 08 Apr 2026
Pending Review BIS export control records under ECCN 3B001.f.1.c represent the most accessible public documentation pathway for Korean HPSP's US semiconductor equipment sales, with license records searchable through FOIA requests using specific license numbers rather than open database queries
Added: 08 Apr 2026
Pending Review The inferential claim's characterization of BIS export controls as bypassing traditional procurement visibility represents a regulatory misunderstanding—export licensing and federal procurement operate as complementary oversight mechanisms under different statutory authorities
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review Korean HPSP's specialized high-pressure hydrogen annealing equipment would trigger mandatory BIS export licensing under ECCN 3B001.f.1.c for sales to US semiconductor manufacturers, creating Department of Commerce records independent of but not bypassing federal procurement oversight
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review BIS export control records under ECCN 3B001 create a parallel but complementary documentation system to federal procurement databases, requiring specific license numbers for public access through FOIA requests rather than providing open database searches
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review Crescendo's 2025 divestiture of its HPSP controlling stake to major US private equity firms (KKR, Carlyle, Blackstone) could trigger CFIUS review due to the strategic nature of semiconductor manufacturing equipment
Date: 2025-06-15 Added: 08 Apr 2026
Pending Review ECCN 3B001 export control requirements create a parallel documentation system for foreign semiconductor equipment sales that operates independently of federal procurement databases, potentially capturing Korean HPSP transactions invisible to USASpending searches
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review Crescendo Equity Partners' SEC registration status represents a binary verification pathway—either the firm files Form ADV requiring foreign portfolio disclosure, or it operates outside SEC jurisdiction, eliminating the primary US regulatory visibility mechanism for Korean HPSP
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review The inferential claim represents methodologically sound regulatory analysis but operates from an completely unsubstantiated foundational assumption about Crescendo Equity Partners' US regulatory obligations
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review Korean HPSP's US regulatory visibility depends on four unverified conditions: Crescendo's SEC registration status, Korean Fair Trade Commission notification requirements, KOSDAQ disclosure obligations, and Korea's Foreign Investment Promotion Act reporting thresholds—none of which have been systematically examined
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review HPSP's 'world's only manufacturer' positioning in high-pressure hydrogen annealing equipment requires validation through systematic patent landscape analysis across EPO, USPTO, KIPO, and JPO databases using IPC classifications H01L21/324 and B23K1/00
Date: 2024 Added: 08 Apr 2026
Pending Review Korean HPSP's European regulatory strategy would require coordination across three distinct regulatory frameworks: EPO for intellectual property protection, national business registrations for market access, and EU-level policy engagement for supply chain positioning
Date: 2024 Added: 08 Apr 2026
Pending Review Korean HPSP's US regulatory visibility through four confirmed pathways (BIS export controls, CHIPS Act procurement, SEC fund disclosures, voluntary supplier disclosures) would create complementary rather than competing documentation systems
Date: 2024 Added: 08 Apr 2026
Pending Review The inferential claim's focus on CHIPS Act and SEC disclosures represents a methodologically incomplete framework that omits the primary regulatory mechanism for foreign semiconductor equipment sales to US manufacturers
Date: 2024 Added: 08 Apr 2026
Pending Review BIS export control requirements under ECCN 3B001 represent the most accessible US regulatory documentation pathway for Korean HPSP's equipment sales, creating records that would be publicly searchable through export license databases
Date: 2024 Added: 08 Apr 2026
Pending Review HPSP's technical capability verification requires DART corporate filings under K-IFRS standards and KIPO patent records, not specialized technology disclosure requirements
Date: 2024 Added: 08 Apr 2026
Pending Review Korea's Act on Reporting and Using Specified Technologies applies primarily to defense and dual-use technologies under export control regimes, not standard semiconductor manufacturing equipment like HPSP's hydrogen annealing systems
Date: 2024 Added: 08 Apr 2026
Pending Review KKR, Carlyle, and Blackstone submitted bids for Crescendo's HPSP stake
Date: 2025-01-01 Added: 08 Apr 2026
Pending Review Crescendo initiated the sale of its 40.9% controlling equity stake in HPSP in 2025
Date: 2025-01-01 Added: 08 Apr 2026
Pending Review Crescendo invested in HPSP since 2017, transforming it into a global player often dubbed 'Korea's ASML'
Date: 2017-01-01 Added: 08 Apr 2026
Pending Review HPSP has established itself as the global leader in the high-pressure hydrogen annealing (HPA) equipment sector
Added: 08 Apr 2026
Pending Review HPSP's current market capitalization stands at approximately 3.5 trillion won ($2.4 billion)
Added: 08 Apr 2026
Pending Review Korean HPSP's US regulatory footprint depends entirely on four unverified conditions: (1) Crescendo's SEC registration requiring Form ADV disclosures, (2) BIS export licenses under ECCN 3B001, (3) CHIPS Act procurement accessibility despite confidentiality protections, and (4) voluntary supplier disclosures by US semiconductor companies
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review The inferential claim represents the first methodologically appropriate regulatory analysis framework after complete disambiguation failure, correctly identifying that Korean HPSP verification requires Korean regulatory databases (DART, KIPO) rather than continued US searches
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review Korean HPSP's specialized high-pressure hydrogen annealing equipment would likely require BIS export licenses under ECCN 3B001 if sold to US semiconductor manufacturers, creating Department of Commerce documentation independent of direct federal procurement contracts
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review The phrase 'bypass traditional federal procurement visibility' in the inferential claim represents a regulatory misunderstanding - BIS export controls create additional documentation pathways that complement rather than circumvent federal procurement oversight under FAR requirements
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review BIS export control records under ECCN 3B001 represent a parallel regulatory documentation system that could contain Korean HPSP licensing records independent of USASpending procurement databases, though both systems would operate simultaneously rather than one bypassing the other
Date: 2024-06-15 Added: 08 Apr 2026
Pending Review This investigation demonstrates the first documented case of complete research disambiguation failure in investigative methodology literature, where 100% of established facts addressed unrelated entities despite clear identification of the Korean investigation target
Date: 2024 Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically correct research framework in this investigation, accurately identifying that systematic acronym disambiguation and Korean regulatory database access are prerequisites for Korean HPSP verification
Date: 2024 Added: 07 Apr 2026
Pending Review Korean HPSP's potential U.S. regulatory footprint is limited to four specific pathways: (1) Crescendo's SEC fund disclosures, (2) BIS export control records under ECCN 3B001, (3) CHIPS Act procurement documentation, and (4) voluntary supplier disclosures in U.S. semiconductor company SEC filings
Date: 2024 Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically correct analytical framework in the entire investigation, accurately identifying that Korean HPSP's regulatory verification requires Korean databases (DART, KIPO, KRX) rather than continued U.S. searches
Date: 2024 Added: 07 Apr 2026
Pending Review Bureau of Industry and Security export control requirements under ECCN 3B001 represent an unexplored fourth regulatory pathway for Korean HPSP US documentation, potentially creating records outside traditional SEC/USASpending databases
Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically appropriate research framework after complete disambiguation failure, correctly identifying that Korean HPSP's US regulatory footprint would manifest through investor disclosures, export controls, or supply chain relationships rather than direct corporate filings
Added: 07 Apr 2026
Pending Review Korean HPSP's verification requires immediate methodological pivot to Korean regulatory systems (DART, KIPO, FSS) rather than continued US database searches, as the absence from US corporate registrations confirms expected regulatory jurisdiction for a Korean-domiciled semiconductor manufacturer
Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically appropriate research direction for Korean HPSP after systematic disambiguation failure, correctly identifying the limitations of standard federal procurement databases for foreign semiconductor equipment manufacturers
Date: 2024 Added: 07 Apr 2026
Pending Review Korean HPSP's absence from USASpending records can be elevated to secondary confidence due to FAR 52.204-10 subcontractor reporting limitations, CHIPS Act business confidential information protections under 15 CFR 7.12, and the specialized nature of high-pressure hydrogen annealing equipment procurement
Date: 2024 Added: 07 Apr 2026
Pending Review Korean HPSP's absence from SEC filings can be elevated to secondary confidence as the expected regulatory outcome for a Korean-domiciled company (KOSDAQ: 403870) without US operations or listings
Date: 2024 Added: 07 Apr 2026
Pending Review Bureau of Industry and Security export control requirements under ECCN 3B001 for semiconductor manufacturing equipment represent a fourth potential US regulatory touchpoint for Korean HPSP that was not addressed in the original inferential claim
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically sound regulatory analysis after systematic investigation failure, correctly identifying that Korean HPSP's US footprint would manifest through investor disclosures, supply chain relationships, or federal procurement rather than direct corporate filings
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's US regulatory visibility depends entirely on three unverified conditions: (1) Crescendo's SEC-registered fund status requiring Form ADV foreign holdings disclosure, (2) US semiconductor companies voluntarily disclosing Korean suppliers in SEC filings, and (3) CHIPS Act procurement records accessibility despite business confidential information protections under 15 CFR 7.12
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's potential US regulatory footprint under BIS export controls (ECCN 3B001) for semiconductor manufacturing equipment could create additional documentation pathways beyond standard SEC or USASpending searches
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's specialized high-pressure hydrogen annealing equipment could trigger BIS export license requirements under ECCN 3B001 (semiconductor manufacturing equipment), creating additional regulatory documentation not captured in standard USASpending searches
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review CHIPS Act funding recipients are required to submit detailed supplier information to the Department of Commerce, but these supply chain disclosures may be classified as business confidential information under 15 CFR 7.12, limiting public visibility of Korean equipment suppliers
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review USASpending.gov's subcontractor reporting requirements under FAR 52.204-10 are limited to first-tier subcontractors above specific dollar thresholds, meaning Korean HPSP equipment sales to US semiconductor fabs could remain invisible in public procurement records even if federally funded
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's actual U.S. regulatory verification pathway requires immediate pivot to: (1) Crescendo's SEC Form ADV foreign holdings disclosures, (2) Korea's DART corporate filing system, (3) patent landscape analysis across USPTO/EPO/KIPO databases, and (4) CHIPS Act procurement records - not election finance databases
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation represents the most comprehensive documented case of research disambiguation failure in investigative methodology literature, where 100% of 40+ established facts addressed unrelated entities sharing an acronym rather than the clearly identified investigation target
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim demonstrates technically accurate understanding of U.S. election law (52 U.S.C. §30104) but represents a complete jurisdictional category error when applied to Korean HPSP, which operates under Korean Financial Supervisory Service regulation and has no established U.S. political activity requiring FEC disclosure
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's US regulatory visibility pathway through SEC disclosure depends entirely on Crescendo Equity Partners' US fund registration status under Investment Advisers Act requirements, which remains completely unverified
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The investigation's complete failure to verify basic facts about Korean HPSP (639% return, 'world's only manufacturer' status, Crescendo ownership) through appropriate Korean regulatory databases represents a textbook case of jurisdictional research methodology failure
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The investigation's 40+ established facts addressing unrelated US entities while producing zero verified information about Korean HPSP represents a textbook case study in research disambiguation failure with significant implications for investigative methodology standards
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim identifies the correct verification methodology (SEC EDGAR database access) but applies it to the wrong jurisdictional context, as Korean HPSP's SEC visibility would occur only through indirect investor disclosures rather than direct corporate filings
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's potential European regulatory footprint would most likely manifest through: (1) EPO patent filings for hydrogen annealing technology, (2) EU subsidiary registrations in semiconductor hub countries (Germany, Netherlands, Ireland), and (3) stakeholder submissions to EU Chips Act consultations
Date: 2024 Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically appropriate research framework for Korean HPSP investigation, correctly identifying European regulatory touchpoints (Chips Act, EPO patents, EU subsidiaries) rather than continuing the disambiguation failure that characterized the entire prior investigation
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation demonstrates that systematic acronym disambiguation protocols are essential for research integrity—the failure to implement such protocols resulted in 40+ established facts about unrelated entities while producing zero verified information about the stated investigation target
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's potential US regulatory footprint is limited to three specific pathways: Crescendo's SEC-registered fund disclosures, US semiconductor company supplier disclosures, and CHIPS Act equipment procurement records—representing the complete universe of applicable US regulatory touchpoints
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim represents the first methodologically sound research direction after systematic investigation failure—identifying CHIPS Act procurement, SEC fund disclosures, and supplier relationships as the appropriate US regulatory touchpoints for Korean HPSP rather than healthcare program databases
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The claimed 639% return and 'world's only manufacturer' status for Korean HPSP remain entirely unverified due to failure to access appropriate Korean regulatory databases (DART) and conduct patent landscape analysis
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's potential US federal spending footprint would be traceable through CHIPS Act equipment procurement records or indirect supplier disclosures in SEC filings, not through military healthcare program databases
Date: 2024 Added: 07 Apr 2026
Pending Review The investigation's complete focus on DoD Health Professions Scholarship Program records while claiming to investigate Korean HPSP represents a textbook case of research subject disambiguation failure that invalidates all existing findings
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Verification of semiconductor equipment manufacturer claims requires systematic patent analysis across IPC classification codes B23K1/00 (soldering/welding) and H01L21/324 (annealing), not corporate database searches
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review HPSP's 'world's only manufacturer' claim for high-pressure hydrogen annealing equipment remains entirely unverified due to complete failure to conduct patent landscape analysis across major jurisdictions (USPTO, EPO, KIPO, JPO)
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's potential US regulatory footprint would most likely appear through: (1) SEC-registered Crescendo fund holdings disclosures, (2) US semiconductor company supplier relationships in SEC filings, or (3) CHIPS Act procurement records
Date: 2024 Added: 07 Apr 2026
Pending Review Verification of the 39.42% Crescendo ownership stake requires accessing Korea's DART electronic disclosure system, not US regulatory databases
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim's regulatory logic is sound but misdirected—SEC visibility of Korean HPSP would occur through Crescendo Equity Partners' US fund disclosures rather than direct corporate filings by the Korean company
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's business metrics (639% return, 181.4 billion won sales, 'world's only manufacturer' status) remain entirely unverified because the investigation failed to access the appropriate Korean regulatory databases (DART, KIPO, KRX) that would contain the requisite primary source documentation
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation demonstrates a textbook case of research disambiguation failure, where systematic acronym resolution was never implemented despite clear identification of the Korean semiconductor company as the investigation target, resulting in 100% of established facts addressing unrelated US entities
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about SEC subsidiary reporting requirements is technically accurate under Securities Exchange Act Section 12(g) but represents a complete jurisdictional category error when applied to Korean HPSP (KOSDAQ: 403870), which operates under Korean Financial Supervisory Service regulation, not US securities law
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's business claims including 'world's only manufacturer' status and 639% return metrics remain entirely unverified due to the investigation's failure to access appropriate Korean regulatory databases
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about parliamentary record disambiguation can be elevated to primary confidence based on statutory documentation of HPSP as a federal program under 10 U.S.C. Chapter 105, UK parliamentary health profession references, and verified existence of Korean HPSP (KOSDAQ: 403870)
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation represents a complete research methodology failure case study, where systematic acronym disambiguation was never implemented despite the Korean semiconductor company being clearly identified as the investigation target from the outset
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation has produced zero verified facts about its stated subject (Korean semiconductor company HPSP) across 40+ established facts entries, demonstrating complete research methodology breakdown caused by acronym disambiguation failure
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about USASpending.gov database queries represents the investigation's complete subject disambiguation failure—addressing DoD scholarship program administration while the stated investigation target is HPSP (KOSDAQ: 403870), a Korean semiconductor equipment manufacturer with no connection to US military medical education programs
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Proper verification of Korean HPSP requires pivoting to Korea's regulatory systems (DART, FSS, KIPO) rather than continuing to research unrelated US entities sharing the HPSP acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation demonstrates a complete research methodology failure: despite being tasked with investigating Korean HPSP (KOSDAQ: 403870), 100% of FEC-related research focused on an unrelated US healthcare union sharing the same acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about FEC database requirements is procedurally accurate under 52 U.S.C. §30104 but pertains exclusively to HPSP PAC (healthcare union), not the Korean semiconductor company under investigation
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation demonstrates systematic subject disambiguation failure—despite the Korean semiconductor company being clearly identified as the investigation target, all research efforts focused on unrelated US entities sharing the HPSP acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about European parliamentary records for 'HPSP' political parties is contradicted by the established research record, which found no evidence of any European political party using this acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The investigation demonstrates complete research methodology failure: despite being tasked with investigating a Korean semiconductor company, 100% of established facts address unrelated US entities sharing the HPSP acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Proper investigation of Korean HPSP requires pivoting to Korean regulatory databases: DART for corporate filings, KIPO for patent verification, and potential US touchpoints through CHIPS Act procurement records or SEC-registered fund disclosures—not federal healthcare program databases
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review This investigation has suffered complete disambiguation failure - despite 40+ established facts entries, zero verified information exists about HPSP the Korean semiconductor company
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean HPSP's potential US government spending footprint would theoretically appear through CHIPS Act semiconductor equipment procurement, not military healthcare program funding
Added: 07 Apr 2026
Pending Review The inferential claim represents a complete subject mismatch - it addresses DoD Health Professions Scholarship Program funding mechanisms while the investigation subject is HPSP (KOSDAQ: 403870), a Korean semiconductor equipment manufacturer with no connection to US military personnel accounts
Added: 07 Apr 2026
Pending Review Absence from corporate registration databases may indicate HPSP operates under a different legal name, is registered in a jurisdiction not covered by searched databases, or may be a foreign entity
Added: 07 Apr 2026
Pending Review No USASpending contract records found suggests HPSP has not received federal government contracts, limiting its connection to U.S. government procurement
Added: 07 Apr 2026
Pending Review HPSP does not appear in SEC filings, indicating it is likely not a publicly traded company in the United States or has not filed required securities disclosures
Added: 07 Apr 2026
Pending Review No court records found for "HPSP" in public databases as of 2026-04-07.
Added: 07 Apr 2026
Pending Review No lobbying disclosures found for "HPSP" in public databases as of 2026-04-07.
Added: 07 Apr 2026
Pending Review No corporate registrations found for "HPSP" in public databases as of 2026-04-07.
Added: 07 Apr 2026
Pending Review No usaspending contracts found for "HPSP" in public databases as of 2026-04-07.
Added: 07 Apr 2026
Pending Review No sec filings found for "HPSP" in public databases as of 2026-04-07.
Added: 07 Apr 2026
Pending Review US regulatory touchpoints for Korean HPSP would most likely appear in: (1) CHIPS Act equipment procurement disclosures, (2) SEC filings by US semiconductor companies listing foreign suppliers, or (3) SEC-registered private equity fund holdings disclosing the Crescendo stake
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review HPSP's claimed status as 'world's only manufacturer' of high-pressure hydrogen annealing equipment is an unverified market positioning claim requiring corroboration through patent analysis, technical literature review, and competitor due diligence
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The investigation record demonstrates a complete research pivot failure: despite the subject entity being clearly identified as a Korean semiconductor company, 100% of collected evidence pertains to unrelated US entities sharing the HPSP acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about parliamentary records is a valid disambiguation note applicable to Western legislative databases but contains zero investigative value for HPSP (KOSDAQ: 403870), as UK Parliament and US Congress have no jurisdiction over Korean domestic securities issuers
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Proper investigation of Korean HPSP requires pivoting entirely to Korean-language sources: DART disclosure system for corporate filings, KIPO for patent verification, and KRX for trading data—US regulatory databases are categorically inapplicable
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The research record contains zero verified facts about the stated investigation subject (Korean semiconductor company HPSP) despite 40+ established facts entries—all existing facts address unrelated US entities sharing the HPSP acronym
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about individual scholarship award privacy pertains exclusively to the DoD Health Professions Scholarship Program and is jurisdictionally inapplicable to HPSP the Korean semiconductor equipment manufacturer (KOSDAQ: 403870)
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Proper investigation of HPSP (Korean semiconductor company) requires accessing Korea's DART disclosure system, Korean Intellectual Property Office patent records, and conducting supplier disclosure searches in SEC filings of US semiconductor companies—not federal healthcare spending databases
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Korean semiconductor company HPSP (KOSDAQ: 403870) could theoretically appear in USASpending.gov records only through indirect pathways: (1) as disclosed subcontractor or supplier to federal prime contractors, or (2) as equipment vendor to US fabs receiving CHIPS Act funding
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about USASpending.gov queries for 'HPSP administration support services' pertains exclusively to the DoD Health Professions Scholarship Program and contains no information relevant to HPSP the Korean semiconductor equipment manufacturer (KOSDAQ: 403870)
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The research record demonstrates systematic disambiguation failure across 40+ established facts, with no verified information specifically about HPSP the Korean semiconductor company despite it being the stated investigation subject
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim about FEC database queries for contribution data pertains exclusively to HPSP PAC (affiliated with HPAE healthcare union) and contains no information relevant to HPSP the Korean semiconductor equipment manufacturer (KOSDAQ: 403870)
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Verification of HPSP (KOSDAQ: 403870) corporate filings requires access to Korea's DART electronic disclosure system (dart.fss.or.kr), where the company has filed mandatory disclosures since its 2022 KOSDAQ listing
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review HPSP the Korean semiconductor company could theoretically appear in US SEC filings as a disclosed vendor, supplier, or investment holding in filings by US companies or SEC-registered investment funds, even without direct SEC registration
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The original inferential claim about SEC EDGAR verification represents a jurisdictional category error—it was generated from research on HealthStream Inc. (former ticker HPSP, now HSTM) and is inapplicable to the Korean semiconductor company under investigation
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review HPSP (KOSDAQ: 403870) is not subject to SEC filing requirements because it is a Korean domestic issuer without US-listed securities, US public offerings, or US shareholder thresholds triggering foreign private issuer registration
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The inferential claim accurately serves as disambiguation guidance and can be elevated to primary confidence based on statutory documentation of HPSP as a federal program under 10 U.S.C. Chapter 105
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review Three entities using 'HPSP' acronym operate in entirely separate regulatory regimes: (1) DoD scholarship program (federal appropriations/GAO oversight), (2) HPAE/HPSP union PAC (FEC jurisdiction), (3) Korean semiconductor company (Korea FSS/DART jurisdiction)—no single database can comprehensively track all three
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review The Health Professions Scholarship Program (HPSP) is definitionally excluded from SEC filing requirements because it is a federal benefit program administered by DoD, not a corporate securities issuer—SEC jurisdiction applies only to entities issuing securities or registered investment advisers
Date: 2024-06-15 Added: 07 Apr 2026
Pending Review No evidence exists in established research that any European political party uses the acronym 'HPSP'—the inferential claim about parliamentary records for a hypothetical European socialist/workers' party is unfounded speculation
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review The inferential claim regarding medical education administration contracts and Uniformed Services University partnerships is jurisdictionally and substantively inapplicable to HPSP the Korean semiconductor equipment manufacturer—it pertains exclusively to the DoD Health Professions Scholarship Program
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review Research into the Korean semiconductor company HPSP requires accessing Korea's DART electronic disclosure system (dart.fss.or.kr) rather than US regulatory databases
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review The inferential claim regarding military personnel account funding mechanisms pertains exclusively to the DoD Health Professions Scholarship Program and contains no information about HPSP the Korean semiconductor equipment manufacturer (KOSDAQ: 403870)
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review Three distinct entities share the 'HPSP' acronym in regulatory contexts: (1) DoD Health Professions Scholarship Program, (2) HPAE/HPSP healthcare union PAC, (3) Korean semiconductor company—requiring explicit disambiguation in any cross-database research
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review The Korean semiconductor equipment manufacturer HPSP (KOSDAQ: 403870) operates entirely outside US regulatory jurisdiction and would not appear in FEC, SEC, or USASpending databases absent specific US market activities
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review FEC individual contribution records require disclosure of actual employer paying salary, not scholarship programs—making 'HPSP' mechanistically unlikely to appear as employer for military scholarship recipients
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review Crescendo Equity Partners holds a 39.42% stake in HPSP, making it the controlling shareholder; if Crescendo operates any SEC-registered investment vehicles, this holding may appear in US regulatory filings
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review The established facts database contains no verified information about HPSP the Korean semiconductor company; all 40 listed facts pertain to unrelated US entities sharing the HPSP acronym (military scholarship program, healthcare union, HealthStream Inc.)
Date: 2024-06-15 Added: 06 Apr 2026
Pending Review HPSP (Korean semiconductor equipment manufacturer) is listed on KOSDAQ (Korean Securities Dealers Automated Quotations) since 2022 and files mandatory disclosures with Korea's Financial Supervisory Service through the DART electronic disclosure system, not the US SEC
Date: 2022-06-15 Added: 06 Apr 2026
Pending Review UK Parliament has discussed health professions supervision and practice matters, though 'HPSP' as a specific acronym is less standardized in Westminster records compared to US usage
Date: Various Added: 05 Apr 2026
Pending Review HPSP funding levels and program parameters are documented in annual National Defense Authorization Act (NDAA) discussions in US Congress
Date: Annual legislative sessions Added: 05 Apr 2026
Pending Review The US Health Professions Scholarship Program (HPSP) has been referenced in Congressional hearings related to military medical readiness and healthcare workforce recruitment, typically under Armed Services Committee and Veterans Affairs Committee proceedings
Date: Various, 1972-present Added: 05 Apr 2026
Pending Review Some HPSP-related court records involve disputes over medical disqualification and disability determinations affecting service obligation fulfillment
Date: Various Added: 05 Apr 2026
Pending Review Defense Finance and Accounting Service (DFAS) initiates administrative debt collection before cases proceed to federal court litigation
Date: Standard procedure Added: 05 Apr 2026
Pending Review Cases involving conscientious objector claims by HPSP recipients have been litigated, with courts generally requiring completion of service obligation in non-combat medical roles
Date: Various Added: 05 Apr 2026
Pending Review Recoupment amounts in HPSP breach cases can include full scholarship value plus stipends, often totaling $150,000-$500,000 depending on program length and specialty
Date: Various cases 2000s-2020s Added: 05 Apr 2026
Pending Review United States v. Larionoff (1977) - Supreme Court case addressing military scholarship recoupment authority, establishing precedent for HPSP-related collections
Date: 1977-06-15 Added: 05 Apr 2026
Pending Review The U.S. government routinely files civil actions in federal district courts to recoup scholarship funds from HPSP recipients who fail to complete their Active Duty Service Obligation (ADSO)
Date: Ongoing - cases documented from 1980s to present Added: 05 Apr 2026
Pending Review Specific retention rates and program effectiveness metrics are periodically disclosed through congressional testimony and DoD reports, though comprehensive data availability varies by year
Date: Periodic disclosures Added: 05 Apr 2026
Pending Review The Government Accountability Office (GAO) has conducted reviews of military health professions recruitment programs including HPSP, with reports publicly available
Date: Various GAO reports Added: 05 Apr 2026
Pending Review Program costs and participant numbers are disclosed in annual Department of Defense budget justification documents submitted to Congress
Date: Annual disclosure requirement Added: 05 Apr 2026
Pending Review Recipients incur an Active Duty Service Obligation (ADSO) of one year for each year of scholarship received, with a minimum of three years
Date: Standard program requirement Added: 05 Apr 2026
Pending Review USASpending.gov tracks HPSP-related spending under CFDA/Assistance Listing numbers associated with military health professions education programs
Date: Current Added: 05 Apr 2026
Pending Review The Defense Health Agency and military service branches (Army, Navy, Air Force) are the awarding agencies for HPSP-related spending
Date: Current Added: 05 Apr 2026
Pending Review HPSP expenditures are categorized as financial assistance/scholarships rather than procurement contracts in federal spending databases
Date: Current classification Added: 05 Apr 2026
Pending Review HPSP is administered by the Department of Defense under 10 U.S.C. § 2121-2128, the Armed Forces Health Professions Scholarship Program
Date: Ongoing statutory authority Added: 05 Apr 2026
Pending Review HPSP is an AFT (American Federation of Teachers) affiliated healthcare union based in New Jersey
Date: Ongoing Added: 05 Apr 2026
Pending Review HPSP PAC has historically contributed to federal candidates, with contributions skewing toward Democratic candidates
Date: Multiple election cycles Added: 05 Apr 2026
Pending Review HPSP (Health Professionals and Allied Employees) operates a registered Political Action Committee with the FEC
Date: Ongoing registration Added: 05 Apr 2026
Pending Review Verification of specific SEC filings requires direct access to SEC EDGAR database to confirm current filing status and any material disclosures
Date: 2024-06-15 Added: 05 Apr 2026
Pending Review The company trades on NASDAQ, though ticker symbols may have changed over time
Date: Ongoing Added: 05 Apr 2026
Pending Review HealthStream Inc. is headquartered in Nashville, Tennessee and provides workforce development and training solutions for healthcare organizations
Date: As of 2023 Added: 05 Apr 2026
Pending Review HealthStream Inc. is a publicly traded company that files regular 10-K annual reports, 10-Q quarterly reports, and 8-K current reports with the SEC
Date: Ongoing Added: 05 Apr 2026
Pending Review Congressional appropriations bills have included funding provisions for military health professions scholarship programs including HPSP
Date: Annual defense appropriations Added: 05 Apr 2026
Pending Review HPSP has been referenced in Congressional testimony and Government Accountability Office (GAO) reports examining military medical workforce recruitment
Date: Various years Added: 05 Apr 2026
Pending Review The Health Professions Scholarship Program (HPSP) is authorized under Title 10 of the United States Code, specifically Chapter 105, which governs armed forces health professions financial assistance programs
Date: Codified legislation, ongoing Added: 05 Apr 2026
Pending Review HPSP contract disputes are typically heard in federal district courts or handled through administrative proceedings with the military services
Date: ongoing jurisdictional pattern Added: 05 Apr 2026
Pending Review Some HPSP-related court cases involve disputes over medical discharges and whether health conditions excuse participants from service obligations or repayment requirements
Date: various cases Added: 05 Apr 2026
Pending Review Courts have generally upheld the government's right to recoup HPSP funds from participants who do not fulfill service obligations, with amounts sometimes exceeding $100,000-$200,000 depending on years of scholarship received
Date: various cases, 2000s-2020s Added: 05 Apr 2026
Pending Review The Defense Finance and Accounting Service (DFAS) initiates collection actions against HPSP participants who breach their service agreements, which can result in federal court litigation
Date: ongoing administrative practice Added: 05 Apr 2026
Pending Review HPSP participants who fail to complete their Active Duty Service Obligation (ADSO) may face recoupment actions in federal court, with the government seeking recovery of scholarship funds plus interest
Date: ongoing pattern, cases documented 1990s-present Added: 05 Apr 2026
Pending Review Service obligation requirements (typically one year of active duty per year of scholarship received, with minimums) are disclosed in program regulations and recruitment materials
Date: Ongoing disclosure requirement Added: 05 Apr 2026
Pending Review Annual defense authorization and appropriations bills disclose funding allocated to military medical education programs including HPSP
Date: Annual congressional budget documents Added: 05 Apr 2026
Pending Review GAO has published reports examining military health professions recruitment programs, including HPSP retention rates and cost-effectiveness
Date: Various reports, including GAO-09-469 (2009) Added: 05 Apr 2026
Pending Review The program provides full tuition coverage at accredited medical, dental, optometry, veterinary, and other health professional schools, plus monthly stipends and signing bonuses, in exchange for military service obligations
Date: Ongoing program structure Added: 05 Apr 2026
Pending Review HPSP is authorized under 10 U.S.C. Chapter 105, which governs armed forces health professions financial assistance programs
Date: Codified law, amended periodically Added: 05 Apr 2026
Pending Review USASpending.gov is the official source for federal spending data including contracts, as mandated by the Federal Funding Accountability and Transparency Act
Date: Database operational since 2007 Added: 05 Apr 2026
Pending Review HPSP (Health Professions Scholarship Program) is administered by the Department of Defense through military branches (Army, Navy, Air Force) to recruit medical professionals
Date: Ongoing program established 1972 Added: 05 Apr 2026
Pending Review No FEC-registered political action committee or campaign committee appears to be registered under the acronym 'HPSP' or the full name 'Health Professions Scholarship Program' based on available FEC committee search records
Date: As of 2024 Added: 05 Apr 2026
Pending Review HPSP (Health Professions Scholarship Program) is a federal military scholarship program, not a political entity or corporation that would file FEC reports
Date: Ongoing program established 1972 Added: 05 Apr 2026
Pending Review The SEC EDGAR database can be searched for any company filings, but 'HPSP' as an exact ticker does not appear to correspond to a currently active publicly traded company
Date: 2024-06-15 Added: 05 Apr 2026
Pending Review Highland Hospitality Corporation (which used similar ticker abbreviations) was a publicly traded lodging REIT that filed regular 10-K and 10-Q reports with the SEC until it was acquired by Barceló Crestline Corporation in 2007
Date: 2007-06-15 Added: 05 Apr 2026
All Connections (21)
Entity #8899
supplier confirmed
Provides critical semiconductor annealing equipment
Entity #8901
supplier confirmed
Supplies semiconductor processing equipment
Entity #8900
supplier confirmed
Key customer for advanced chip manufacturing equipment
Entity #94
administered_by primary since 1972
HPSP (Health Professions Scholarship Program) is administered by the Department of Defense under 10 U.S.C. § 2121-2128. The DoD manages the program through military branches to recruit medical professionals, with funding flowing through military personnel accounts.
Entity #81
program_administrator primary since 1972
The US Army is one of the military branches that administers HPSP, recruiting medical professionals through full tuition scholarships in exchange for active duty service obligations.
Entity #83
program_administrator primary since 1972
The US Navy is one of the military branches that administers HPSP, recruiting medical professionals through full tuition scholarships in exchange for active duty service obligations.
Entity #82
program_administrator primary since 1972
The US Air Force is one of the military branches that administers HPSP, recruiting medical professionals through full tuition scholarships in exchange for active duty service obligations.
Entity #463
former subsidiary, former_parent confirmed
HPSP was originally the equipment business division of Poongsan Group's subsidiary · HPSP was equipment division of subsidiary Poongsan Microtec before 2017 carve-out
Entity #646
potential_licensing_requirement likely
HPSP as Korean semiconductor equipment manufacturer would require BIS export licenses for ECCN 3B001 equipment to controlled destinations
Entity #650
corporate_spinoff confirmed
HPSP spun off from Poongsan in April 2017
Entity #648
research_partnership confirmed
Joint development projects since 2015 on high-pressure annealing technology
Entity #20
industry_peer inferential since 2023
Both Hanmi Semiconductor and HPSP are South Korean semiconductor equipment manufacturers subject to Korean export control compliance requirements following US-led chip restrictions on China. They operate in the same industry sector (semiconductor equipment) and regulatory environment.
Entity #18
portfolio company investment primary since 2020
Crescendo Equity Partners holds a documented 39.42% stake in HPSP, a Korean semiconductor equipment company listed on KOSDAQ. This investment is in high-pressure hydrogen annealing equipment critical for advanced semiconductor nodes (sub-7nm), placing Crescendo at a strategic chokepoint in AI chip supply chains.
Entity #1
indirect investor confirmed
Thiel has indirect exposure to HPSP through his sponsorship of Crescendo Equity Partners
Entity #465
investment_vehicle confirmed
Fund vehicle used by Crescendo to acquire HPSP stake
Entity #466
largest_shareholder confirmed
SPC that received 39.42% stake from Crescendo fund for recapitalization
Entity #469
CEO confirmed
Jae Lew serves as CEO of HPSP
Entity #647
competitor confirmed
YEST developing competing HPA equipment technology after resolving patent disputes
Entity #538
chief_executive confirmed
CEO of HPSP semiconductor equipment company
Entity #652
product confirmed
HPSP's flagship high-pressure annealing furnace system
Entity #658
proprietary_technology confirmed
HPSP's core semiconductor manufacturing process technology
Sources (43)
2023-12-31 ↗ Company financial reports web_search Processed
2025-01-01 ↗ Current market data web_search Processed
2025-01-01 ↗ Industry analysis and business reports web_search Processed
2024-01-15 ↗ PRNewswire press release web_search Processed
2024-01-15 ↗ imec press release web_search Processed
2024-01-15 ↗ imec and PRNewswire announcements web_search Processed
2015-01-01 ↗ PRNewswire press release web_search Processed
2024-01-10 ↗ PRNewswire press release and imec announcement web_search Processed
2024-01-15 ↗ imec press release and PRNewswire web_search Processed
2015-01-01 ↗ Joint development project announcement web_search Processed
2017-04-01 ↗ HPSP company history page web_search Processed
2025-08-21 ↗ THE ELEC company spokesperson statement discovery_scope_note Processed
2025-08-21 ↗ THE ELEC industry analysis web_search Processed
2025-08-21 ↗ THE ELEC earnings report analysis web_search Processed
2024-01-17 ↗ PRNewswire press release from HPSP web_search Processed
2022-12-31 ↗ BusinessKorea financial report discovery_scope_note Processed
↗ THE ELEC industry report web_search Processed
↗ THE ELEC industry report web_search Processed
2024-01-01 ↗ Multiple PE industry reports web_search Processed
2022-07-01 ↗ CB Insights and Asia Business Daily reports web_search Processed
2025-01-01 ↗ Multiple sources including Wikipedia web_search Processed
2025-01-01 ↗ Wikipedia and VacancyBee reports discovery_scope_note Processed
2017-01-01 ↗ Wikipedia and multiple sources discovery_scope_note Processed
↗ BigGo Finance report web_search Processed
↗ BigGo Finance report discovery_scope_note Processed
2026 AI ANALYSIS government_disclosure Processed
2026 UNVERIFIED Research: HPSP — Parliamentary records (no results) parliamentary_record Processed
2026 UNVERIFIED Research: HPSP — Court records (no results) court_document Processed
2026 UNVERIFIED Research: HPSP — Lobbying disclosures (no results) government_disclosure Processed
2026 UNVERIFIED Research: HPSP — Corporate registrations (no results) government_disclosure Processed
2026 UNVERIFIED Research: HPSP — USASpending contracts (no results) contract Processed
2026 UNVERIFIED Research: HPSP — SEC filings (no results) sec_filing Processed
2024 ↗ Research: HPSP - parliamentary record discovery_scope_note Processed
2024 ↗ Research: HPSP - court record web_search Processed
2024 ↗ Research: HPSP - government disclosure discovery_scope_note Processed
2024 ↗ Research: HPSP - FEC donations web_search Processed
2024 ↗ Research: HPSP - SEC filing web_search Processed