SUBJECT-0647.dossier · company · status: active
YC
subject of file

YEST Co.

Korean semiconductor equipment manufacturer developing high-pressure hydrogen annealing (HPA) equipment as competitor to HPSP
Tracked because Korean semiconductor equipment manufacturer developing high-pressure hydrogen annealing (HPA) equipment as competitor to HPSP · 5 documented connections
Facts on record7
Connections mapped5
Sources cited8
Evidence: 1P 6I
Network web → Timeline → Compare with… → Position Drift → Coverage tone → View on Graph → Export CSV JSON Dossier ← Entity Directory
Stated vs Revealed
No documented contradictions on file.
PATTERN government agency → [regulatory filing] → government agen... 709× PATTERN company → [oversight] → government agency → [oversight] →... 347× PATTERN person → [oversight] → government agency → [oversight] → ... 227× PATTERN company → [subsidiary] → company → [competitor] → company 148× PATTERN government agency → [oversight] → company → [competitor] ... 146×
Connection Map
Key Connections
← Bureau of Industry and Security (BIS) government agency
oversight
BIS implemented comprehensive semiconductor manufacturing equipment export controls under ECCN 3B001 affecting Korean entities starting October 7, 2022
← Ministry of Trade, Industry and Energy (MOTIE) government agency
oversight
MOTIE provides regulatory oversight for YEST Co. semiconductor operations in Korea
→ HPSP company
competitor
YEST developing competing HPA equipment technology after resolving patent disputes
Facts (7)
Data Freshness
Ageing Last update: 158d ago · Avg age: 271d
Confidence Tiers: Primary Source — cross-referenced government/corporate filings Pending Review — sourced but not independently verified AI Inference — analytical hypothesis from cross-referencing
✓ Verified Findings (1)
Independently re-checked: a second model read the source artifact and confirmed it supports the extracted claim.
✓ verified Primary Source YEST resolved patent disputes with HPSP and delivered first 75-wafer HPA equipment to global semiconductor foundry customer
Date: 2024-03-23 Added: 08 Apr 2026 ↗ SOURCE: THE ELEC company announcement
All Connections (5)
→ HPSP company
competitor confirmed
YEST developing competing HPA equipment technology after resolving patent disputes
oversight inferential since 2026
YEST Co. is mentioned in context with ECCN 3B001 and semiconductor manufacturing equipment controls, likely as a company subject to these export classifications.
← Scott Tilley person
potential_business_connection inferential since 2026
Scott Tilley appears in the entity list near YEST Co., a South Korean semiconductor equipment company, suggesting a possible business or technical relationship in the defense or semiconductor supply chain.
oversight primary since 2024
MOTIE provides regulatory oversight for YEST Co. semiconductor operations in Korea
oversight primary since 2022
BIS implemented comprehensive semiconductor manufacturing equipment export controls under ECCN 3B001 affecting Korean entities starting October 7, 2022
Sources (8)
2026-05-10 UNVERIFIED SEARCH_ERROR: YEST Co. not found in opencorporates claim_flag Processed 📜 Receipt
2026 UNVERIFIED Research: YEST Co. — Parliamentary records (no results) parliamentary_record Processed 📜 Receipt
2026 UNVERIFIED Research: YEST Co. — Court records (no results) court_document Processed 📜 Receipt
2026 UNVERIFIED Research: YEST Co. — Lobbying disclosures (no results) government_disclosure Processed 📜 Receipt
2026 UNVERIFIED Research: YEST Co. — Corporate registrations (no results) government_disclosure Processed 📜 Receipt
2026 UNVERIFIED Research: YEST Co. — USASpending contracts (no results) contract Processed 📜 Receipt
2026 UNVERIFIED Research: YEST Co. — SEC filings (no results) sec_filing Processed 📜 Receipt
2024-03-23 ↗ THE ELEC company announcement web_search Processed 📜 Receipt